Microelectronic component of sandwich construction

US6324072A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Leo Lorenz · Farmington, US
• Michael Kaindl · Brackenheim, DE
• Herbert Schwarzbauer · Munich, DE
• Gerhard Munzing · Wilmslow, GB
• Peter Stern · New York, US
• Manfred Bruckmann · Wendelstein, DE

Key dates

• Filing date: Mar 30, 1999
• Grant date: Nov 27, 2001
• Expiry date: Mar 30, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49144
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A microelectronic component of sandwich construction, that includes a first substrate with a first conductor track plane and a second substrate with a second conductor track plane, between which many semiconductor chips are disposed. The contacting of the second conductor track plane to the adjacent surface of the semiconductor chips is effected by fixed contacting means, in particular with the soldered connections, an electrically conductive adhesive, or electrically conductive balls. The microelectronic components of the invention are suitable in particular as power components and can be used for instance in inverters. The invention also relates to a method for producing the microelectronic component.