Polishing pads and methods relating thereto
US6325703A · kind A · utility
10Cited by
13References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2001 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Mar 22, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C43/203
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad having a uniform, continuously interconnected porous surface. The pad is produced by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer. The sintering process is conducted at a pressure in excess of 100 psi and in a mold having the desired final pad dimensions. In a preferred version, a mixture of two polymer powders is used, where one polymer has a lower melting point than the other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.