Apparatus for applying a liquid coating with an improved spray nozzle
US6325853A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1997 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Jun 19, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S118/02
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Apparatus and methods for spray coating selected areas of a circuit board with a liquid coating material without coating regions of the circuit board to be left uncoated. In one mode of operation, a bead of liquid coating material dispensed from an elongated nozzle tip is atomized by directing jets of air pressurized against the bead to form a conical, swirling spray pattern which is sprayed on selected areas of a circuit board. In a second mode of operation, the non-atomized bead of liquid coating material dispensed through the elongated nozzle tip is applied on selected areas of the circuit board. In a third mode of operation, jets of pressurized air are directed against the bead of liquid coating material to create a soft swirl pattern, without atomizing the bead of coating material. In a second embodiment of the invention, the bead of liquid coating material is dispensed from a nozzle without the elongated nozzle tip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.