Palladium colloid solution and its utilization
US6325910A · kind A · utility
17Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1998 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Jun 3, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/424
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a palladium colloid solution, which, in addition to a palladium compound, a protective colloid for stabilizing the colloid and a reducing agent, additionally contains noble metals from the group rhodium, iridium and platinum. The solution can be used to treat electrically non-conductive substrate surfaces, particularly in order to metallize the substrate surfaces directly and electrolytically. By means of this method, the nonconductive areas of the holes in printed circuit boards can be directly electrolytically metallized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.