Diffusion-soldered joint and method for making diffusion-soldered joints

US6326088A · kind A · utility

Inventors

• Rolf Mayer
• Rolf Engelhart · Rutesheim, DE
• Wilfried Reschnar · Schozach, DE
• Godehard Schmitz · Sersheim, DE

Key dates

• Filing date: Aug 7, 1997
• Grant date: Dec 4, 2001
• Expiry date: Aug 7, 2017

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/12847
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A diffusion-soldered joint and a method for making diffusion-soldered joints includes a particularly actively diffusing, low-melting-point intermediate layer, applied in the molten state, introduced in the form of a solder carrier between at least two joint components. The solder carrier includes a metal foil that is equipped on both sides with solder layers, wherein the solder layers may include multiple layers.