Thin-film multilayer wiring board with wiring and via holes in a thickness of an insulating layer
US6326561A · kind A · utility
22Cited by
7References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 1996 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Jul 3, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1093
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin-film multilayer wiring board with first and second metallic wiring layers formed on a substrate and an organic insulating layer interposed between the metallic wiring layers. The insulating layer has the first metallic wiring layer and via holes in a thickness of the insulating layer. The lands of the first and second metallic wiring layers are electrically connected by via studs which are made of a conductive metal filled in the via holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.