Method and device for treating materials with plasma-inducing high energy radiation
US6326589A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2000 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Mar 17, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/1423
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for treating materials with plasma-inducing high-energy radiation, especially laser radiation, where an area of vapor capillaries (13) of a work piece (10) is observed with a depth definition detecting device over the entire thickness of the work piece and time-dependent measurement of plasma radiation intensity is carried out. In order to accurately monitor the quality of material treatment, the method is implemented in such a way that the momentary plasma intensities are measured at no less than two measurement points which are parallel to an axis (11) of inducing radiation (12). Predetermined capillary parameters are assigned to the measured plasma intensities and control of the material treatment is conducted depending on the capillary geometric parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.