Integrated multiple sensor package
US6326611A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1999 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Sep 28, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
Abstract
An integrated dual sensor package comprises a housing, a first sensor assembly and a second sensor assembly. The housing includes an internal vacuum chamber, a first window and a second window. The first window is transparent to a first wavelength of propagating energy and the second window is transparent to a second wavelength of propagating energy. The first sensor assembly and the second sensor assembly each have an active region responsive to a respective one of the first wavelength and second wavelength of propagating energy. The first sensor assembly and the second sensor assembly are each mounted within the vacuum chamber with the active region of each of the first sensor assembly and the second sensor assembly adjacently aligned with a respective one of said first window and said second window. The common alignment structure also serves as a common thermal interface to the external environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.