Patent · US Expired

Carrier element for a semiconductor chip

US6326683A · kind A · utility

18Cited by

13References

13Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Detlef Houdeau · Langquaid, DE
Michael Huber · Bad Abbach, DE
Volker Rohde · Forstinning, DE
Richard Scheuenpflug · Regensburg, DE
Peter Stampka · Burglengenfeld, DE

Key dates

Filing date	Nov 17, 1998
Grant date	Dec 4, 2001
Priority date	—
Expiry date	Nov 17, 2018

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A carrier element for a semiconductor chip which can be incorporated in smart cards and soldered onto circuit boards using SMD technology. For this purpose, a copper lamination of a plastic sheet is structured by etching in such a way that contact areas are formed in one piece with conductor tracks which end at the edge of the carrier element and enable reliable soldering.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.