Apparatus and method for evaluating printed circuit board assembly manufacturing processes
US6326797A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1998 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Mar 4, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0268
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test coupon for measuring the effects of solder processes on circuit testability. The test coupon includes a circuit board having a multiplicity of circuit conductor patterns. Each conductor pattern is connected to a plurality of pads and vias on the circuit board. The circuit pads on an opposite surface of the circuit board support solder connections to a plurality of different circuit components. The circuit pads are connected to the vias, which in turn are connected to individual conductors of the circuit pattern. A surface connector is also supported on the circuit board, having pins extending through the circuit board. The circuit pattern conductors terminate on a respective connector pin. The test coupon may be subject to in-circuit testing where a value of the various components are measured. The multiple circuit patterns and mounted components permit different types of tester pins to be used to evaluate in-circuit testability in a test coupon used in a particular manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.