Computing device with improved heat dissipation
US6327144A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 21, 1999 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Dec 21, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/345
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A computing device has a housing supporting multiple electronic components. The device housing has peripheral openings to facilitate the operation of internal components (cooling fan, audio speaker, etc.) and to facilitate coupling to external devices (second display, mouse pointing device, printer unit, etc.). To prevent liquids from entering into the housing, the openings are covered with a liquid-resistant, heat-permeable material, thereby creating a liquid-resistant barrier to prevent liquids from penetrating into the device's housing. Further, the liquid-resistant, heat-permeable material is breathable to allow heat dissipation from the electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.