Patent · US Expired

Cover structure for a wireless communication device and method in its manufacture as well as a wireless communication device

US6327153A · kind A · utility

11Cited by
14References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 22, 1998
Grant dateDec 4, 2001
Priority date
Expiry dateSep 22, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K5/0273
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

The present invention relates to a cover structure for a wireless communication device arranged at least partly as a standard expansion card, and the cover structure (3) being provided with at least one cover surface (3a, 3b). The cover surface (3a, 3b) is provided with at least one elongated bracing groove (G1 to G3) for increasing the dimensional stability of the cover surface (3a, 3b, 4a, 4b, 4c). In an advantageous embodiment of the cover structure (3), the thickness of the cover structure (3) at the bracing groove corresponds substantially to the thickness of the cover structure (3) at the cover surface (3a, 3b), and the bracing groove (G1 to G3) extends substantially over the cover surface (3a, 3b) and the depth of the bracing groove (G1 to G3) is smaller than the thickness of the cover structure (3) at the cover surface (3a, 3b). The present invention relates also to a method in the manufacture of the cover structure for a wireless communication device. The present invention relates further to a wireless communication device which is arranged at least partly as a standard expansion card and comprises at least one cover structure (3) provided with at least one cover surface (…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.