Adhesive tape sensor for detecting and evaluating coating and substrate degradation utilizing electrochemical processes
US6328878A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1999 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Aug 11, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N17/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A portable and nondestructive adhesive tape corrosion sensor which is utilized under actual field or laboratory conditions in detecting coating and substrate degradation using Electrochemical Impedance Spectroscopy (EIS) of coated or uncoated metal structures has been developed. The invention allows for broad applicability, flexibility in utilizing the sensor in various environments without structural compromise and the ability to inspect and evaluate corrosion of the actual structure, regardless of the size, shape, composition, or orientation of the structure. The electrodes may be removed once a measurement is made or remain in the original fixed position so that subsequent measurements may be made with the same electrode. The nondestructive sensor apparatus is comprised of a pressure-sensitive adhesive tape that consists of a conductive film or foil and conductive adhesive overlapping another pressure-sensitive adhesive tape that consists of a conductive film or foil and non-conductive adhesive. The conductive tape serves as the sensing element or device. The non-conductive tape serves as the lead between the sensing element and the point of measurement. In an alternative config…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.