Wafer for magnetic head and magnetic head
US6329087A · kind A · utility
31Cited by
2References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 13, 1999 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Jul 13, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1157
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wafer includes an insulating layer provided on a wafer substrate and formed of a film composition represented by a formula, Al--N.sub.(1-x) --O.sub.x (wherein 0.05.ltoreq..times..ltoreq.0.8). There is provided a wafer for a magnetic head as well as a magnetic head which is excellent in heat transferring property; in which the instability of a magnetic head characteristic due to a temperature rise is produced, and a reduction in output due to the polishing at a finishing step cannot be produced; and which is excellent in water resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.