Dip-molded medical devices from cis-1,4-polyisoprene
US6329444A · kind A · utility
63Cited by
12References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1998 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Oct 14, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S528/932
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Medical devices of synthetic rubber are prepared from cis-1,4-polyisoprene by dip molding without the use of sulfur containing components. The devices have surprisingly favorable tensile characteristics despite what is known in regard to synthetic cis-1,4-polyisoprene. In addition, the absence of both the proteins present in natural rubber and the sulfur components that are typically used in vulcanization of both natural rubber and cis-1,4-polyisoprene of the prior art renders the devices freely usable without causing the user to suffer Type I or Type IV allergic reactions that typically arise from contact with natural rubber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.