Hot melt adhesive based on semicrystalline flexible polyolefins
US6329468A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 21, 2000 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Jan 21, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/60
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A flexible polyolefin-based hot melt adhesive composition having a variety of end uses, particularly in bonding polyethylene and polypropylene films, nonwoven fabrics and elastic attachment applications in nonwoven disposable articles. The composition includes a flexible polyolefin polymer or a blend of flexible polyolefin polymers, a tackifier resin, a plasticizer, and optionally a wax and a stabilizer. The preferred flexible polyolefin polymer has a melt flow rate greater than 5 g/10 min. and a density between 0.86 to 0.90 g/cm.sup.3. The hot melt adhesive composition provides a novel combination of desirable properties including good adhesion to a variety of substrates, low viscosity, good heat stability and oil resistance. The adhesive can be applied using common application techniques such as extruding or spraying.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.