Thick film thermal head
US6330015A · kind A · utility
0Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2000 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Aug 10, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/3357
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thick film thermal head includes an electrical insulating substrate and a photosensitive material layer which is formed on the substrate and is provided with a linear groove formed on a surface thereof by exposing it to light. An elongated resistance heater is embedded in the groove, and a plurality of electrodes are formed on the surface of the photosensitive material layer in contact with the resistance heater and arranged in the longitudinal direction of the resistance heater.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.