Method of shrink fitting crystalline sapphire
US6330741A · kind A · utility
4Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1999 |
| Grant date | Dec 18, 2001 |
| Priority date | — |
| Expiry date | Oct 5, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The technique of shrink fitting technique described herein is used to bond crystalline sapphire pieces to each other, in particular, the shrink fitting of a c-axis sapphire post to a c-axis sapphire puck. The sapphire dielectric resonator is used successfully from cryogenic temperatures to well above room temperature. The shrink fit bond yields a high strength and rigid attachment which can withstand high shock levels. Since there is no loss, the resonator Q is a maximum, being limited by the sapphire loss tangent only.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.