Heat sink
US6330908A · kind A · utility
58Cited by
14References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2000 |
| Grant date | Dec 18, 2001 |
| Priority date | — |
| Expiry date | Jun 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink includes a base (20) and a number of fins (30). The base includes a bottom plate (21) to be positioned on and in contact with an electronic package, such as a central processing unit, and a column (22) extending from the bottom plate opposite the electronic package. The fins are attached to the column and radially extend therefrom. A gap is formed between the fins and the plate of the base for facilitating air flow through the heat sink. A curved surface (23) may be formed between the column and the base for guiding the air flow away from the fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.