Reduction of blistering and delamination of high-temperature devices with metal film
US6331678A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1999 |
| Grant date | Dec 18, 2001 |
| Priority date | — |
| Expiry date | Oct 29, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device with a multi-layered micro-component electrical connector. The multi-layer micro-component electrical connector includes a dielectric layer, a micro-mesh of a first electrical conductor secured to the dielectric layer, and a second electrical conductor secured to and contacting the micro-mesh to provide electrical communication. The dielectric layer has a dielectric layer thermal expansion coefficient and the first electrical conductor has a thermal expansion coefficient different from the dielectric layer thermal expansion coefficient. Due to the presence of the micro-mesh the device is operable at temperatures above 250.degree. C. without delamination or blistering of the first electrical conductor from the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.