Apparatus for localized preform cooling outside the mold
US6332770A · kind A · utility
12Cited by
4References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1999 |
| Grant date | Dec 25, 2001 |
| Priority date | — |
| Expiry date | Jun 9, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/253
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for providing targeted cooling to a pre-molded article, such as a preform. A cooling pin is inserted into the preform such that it makes contact with targeted area, such as the mold gate area. This permits conductive cooling of the targeted area. The apparatus and method are particularly suited to post-mold cooling in conjunction with a robotic take-out plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.