Polishing method and device
US6332829A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 4, 2000 |
| Grant date | Dec 25, 2001 |
| Priority date | — |
| Expiry date | May 4, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B31/112
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for polishing a surface including a polishing material and one or more magnetic means in contact with the polishing material. The one or more magnetic means react upon the polishing material to plasticize it, whereby the plasticized material is then used to polish the surface. Preferably the polishing material intermittently and repeatedly contacts with the surface for polishing. A method for polishing a planar surface including bringing two or more magnetic means into contact with a polishing material, thereby plasticizing the polishing material. Then a planar side of the surface contacts the plasticized polishing material, so that the plasticized polishing material polishes the surface. Upon contact with the surface, the plasticized polishing material liquidizes. After termination of the contact with the surface, the liquidized polishing material solidifies. The surface is moved and the above steps are repeated a multiplicity of times until the surface is polished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.