CMP polish pad and CMP processing apparatus using the same
US6332832A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 11, 2000 |
| Grant date | Dec 25, 2001 |
| Priority date | — |
| Expiry date | Apr 11, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D7/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A CMP polish pad used to chemically and mechanically polish a work to be polished. The CMP polish pad has polishing portions of two or more types, that have different conditions of contact with the work, provided on the pad surface. For example, polishing portions of a plurality of types having different coefficients of elasticity with respect to compression in the direction of pressing against the work may be provided on the pad surface. Also polishing portions of a plurality of types having different areas of contact with the work may be provided on the pad surface. Further, polishing portions of a plurality of types having different heights above the pad surface may be provided on the pad surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.