Thermoplastic resin composition and sheets and cards made from the same
US6333113A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 1998 |
| Grant date | Dec 25, 2001 |
| Priority date | — |
| Expiry date | Apr 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Cards which contain any one of the following thermoplastic resin compositions I to III in its material can be used as magnetic cards, IC cards, etc. since they are excellent in heat resistance, processability and embossability: a composition consisting of ingredients (A) and (B); a composition consisting of ingredients (A), (B) and (D); and a composition consisting of 100 parts by weight of one or more selected from the following ingredients (A), (B) and (D) and 2 to 25 parts by weight of the following ingredient (C), wherein ingredient (A) is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, wherein the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) is 1 or more; ingredient (B) is an aromatic polycarbonate; ingredient (C) is an inorganic sheet-like filler of 0.5 to 20 .mu.m in average grain size; and ingredient (D) is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene g…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.