Microelectromechanical systems including thermally actuated beams on heaters that move with the thermally actuated beams
US6333583A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2000 |
| Grant date | Dec 25, 2001 |
| Priority date | — |
| Expiry date | Mar 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2061/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Improved microelectromechanical structures include spaced-apart supports on a microelectronic substrate and a beam that extends between the spaced-apart supports and that expands upon application of heat thereto to thereby cause displacement of the beam between the spaced-apart supports. A heater, located on the beam, applies heat to the beam and displaces with the beam as the beam displaces. Therefore, heat can be directly applied to the arched beam, thereby reducing thermal loss between the heater and the arched beam. Furthermore, an air gap between the heater and arched beam may not need to be heated, thereby allowing improved transient thermal response. Moreover, displacing the heater as the arched beam displaces may further reduce thermal loss and transient thermal response by reducing the separation between the heater and the arched beam as the arched beam displaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.