Sound absorbing cementitious tile
US6334280B1 · kind B1 · utility
29Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 1998 |
| Grant date | Jan 1, 2002 |
| Priority date | — |
| Expiry date | Aug 7, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28B19/0092
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A die assembly for providing a gypsum ceiling tile having improved acoustic absorption properties includes a punch plate having punches which form perforations through a plasterboard tile and indentors which form indentations in the tile. The punches and indentors are arranged in elongate strips to produce fissure-like perforations and indentations. A stripper plate having apertures corresponding to the punches and indentors and a die plate having apertures corresponding to the punches sandwich the tile, and the punch plate is applied to the tile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.