Soldering method
US6334570B1 · kind B1 · utility
6Cited by
11References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2000 |
| Grant date | Jan 1, 2002 |
| Priority date | — |
| Expiry date | Jul 28, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering method aimed to obtain higher bonding strength than conventionally obtained ones. With the soldering method according to the present invention, a Cu mounting surface is soldered with a preliminary solder comprising Sn-Cu, and a component is finally soldered to this preliminarily soldered surface with a solder comprising Sn-Ag-Cu-Bi. Thus, higher bonding strength can be obtained not only in the interface between the preliminary solder surface and the solder for final soldering, but also in the interface between the mounting surface and the preliminary solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.