Chemical mechanical polishing in-situ end point system
US6334807B1 · kind B1 · utility
58Cited by
19References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1999 |
| Grant date | Jan 1, 2002 |
| Priority date | — |
| Expiry date | Apr 30, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A structure and method for polishing a device include oscillating a carrier over an abrasive surface (the carrier bringing a polished surface of the device into contact with the abrasive surface, the oscillating allowing a portion of the polished surface to periodically oscillate off the abrasive surface), optically determining a reflective measure of a plurality of locations of the polished surface as the portion of the device oscillates off the abrasive surface and calculating depths of the locations of the polished surface based of the reflective measure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.