Copper alloy sheet for electronic parts
US6334915B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1999 |
| Grant date | Jan 1, 2002 |
| Priority date | — |
| Expiry date | Mar 19, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C9/06
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A copper alloy sheet comprises 0.4 to 2.5 wt % of Ni, 0.05 to 0.6 wt % of Si, 0.001 to 0.05 wt % of Mg, and the balance being Cu and inevitable impurities wherein an average grain size in the sheet is in the range of 3 to 20 &mgr;m and a size of an intermetallic compound precipitate of Ni and Si is in the range of 0.3 &mgr;m or below. If necessary, the sheet may further comprise one or more of 0.01 to 5 wt % of Zn, 0.01 to 0.3 wt % of Sn, 0.01 to 0.1 wt % of Mn, and 0.001 to 0.1 wt % of Cr. It is preferred that when an X-ray diffraction intensity from {200} plane in the surface of said sheet is taken as I{200}, an X-ray diffraction intensity from {311} plane is taken as I{311}, and an X-ray diffraction intensity from {220} plane is taken as I{220}, the following equation is satisfied[I{200}+I{311}]/I{220}≧0.5
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.