Bonding materials
US6335386B1 · kind B1 · utility
1Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1999 |
| Grant date | Jan 1, 2002 |
| Priority date | — |
| Expiry date | Jun 21, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L97/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition for bonding ligno-cellulosic materials to form shaped products, the composition containing a formaldehyde based thermosetting bonding agent and capsules containing an agent reactive with said bonding agent which is at least one of a resin hardening agent, a flame/fire retardant and a water absorbent, wherein the capsules have walls that are capable of degradation to allow access of the agent to the bonding material, such degradation being at a temperature above the temperature prevailing in the system prior to application of heat in a final compression and heating stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.