Single Paddle having a semiconductor device and a passive electronic component
US6335564B1 · kind B1 · utility
174Cited by
6References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 22, 1998 |
| Grant date | Jan 1, 2002 |
| Priority date | — |
| Expiry date | May 22, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package and a corresponding method of forming this package are provided. The semiconductor package includes a paddle and a semiconductor device mounted on the paddle. A passive electronic component is also mounted on the paddle and spaced apart from the semiconductor device. Interconnects provide a conductive path from a bonding pad of the semiconductor device to a bonding pad of the passive electronic component such that the passive electronic component and semiconductor device are operatively connected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.