Method for separating metallic material from waste printed circuit boards, and dry distillation apparatus used for waste treatment
US6336601B1 · kind B1 · utility
11Cited by
12References
51Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1999 |
| Grant date | Jan 8, 2002 |
| Priority date | — |
| Expiry date | Dec 13, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S241/38
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for treating waste printed circuit boards, the method has the steps of:heating up for dry-distilling the waste printed circuit boards having copper foil retaining solder in at least a part of the surface, at a temperature of 250° C. or higher;pulverizing the dry-distilled material of the waste printed circuit boards obtained in the heating step; andseparating the pulverized material of the waste printed circuit boards obtained in the pulverizing step, into board resin component and metal component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.