Fully integrated thermal inkjet printhead having thin film layer shelf
US6336714B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 1999 |
| Grant date | Jan 8, 2002 |
| Priority date | — |
| Expiry date | Aug 27, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14387
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including ink ejection elements, are formed on a top surface of a silicon substrate. The various layers are etched to provide conductive leads to the ink ejection elements. At least one ink feed hole is formed through the thin film layers for each ink ejection chamber. A trench is etched in the bottom surface of the substrate so that ink can flow into the trench and into each ink ejection chamber through the ink feed holes formed in the thin film layers. The trench completely etches away portions of the substrate near the ink feed holes so that the thin film layers form a shelf in the vicinity of the ink feed holes. In one embodiment, the shelf supports the ink ejection elements. An orifice layer is formed on the top surface of the thin film layers to define the nozzles and ink ejection chambers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.