Apparatus for polishing leads of a semiconductor package
US6336848B1 · kind B1 · utility
3Cited by
12References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 22, 1998 |
| Grant date | Jan 8, 2002 |
| Priority date | — |
| Expiry date | Jul 22, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for polishing leads of a semiconductor package includes a package holder unit on which a plurality of semiconductor packages are arranged; and a polishing member that automatically polished the leads of the semiconductor package on the package holder unit. A mask may be used to cover the plurality of semiconductor packages to expose at least a part of the leads to the polishing member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.