Semiconductor module
US6337512B1 · kind B1 · utility
2Cited by
24References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2000 |
| Grant date | Jan 8, 2002 |
| Priority date | — |
| Expiry date | Mar 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/098
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module having a base element, at least one insulation element arranged on the base element, and at least one semiconductor element arranged on the insulation element. The insulation element has a metal layer on one side and another metal layer on the opposite side. At least one of the metal layers is curved or has curved portions. As a result, it is possible to minimize excessive field increases in the edge zones and increase the dielectric strength of the semiconductor module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.