Semiconductor device and a method of manufacturing the same
US6337521B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 8, 2000 |
| Grant date | Jan 8, 2002 |
| Priority date | — |
| Expiry date | Sep 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Two semiconductor chips sealed with a mold resin are stacked on each other so that their backs are opposite to each other. The two semiconductor chips are supported by suspension leads fixedly secured to a circuit forming surface (lower surface) of the lower chip. A pair of bus bar leads is placed in the vicinity of the sides of these chips, and a plurality of leads are placed thereoutside. Wires are bonded between one surfaces of both the bus bar leads and the leads and one of the two semiconductor chips. Further, wires are bonded between the other surfaces of both the bus bar leads and the leads and the other of the semiconductor chips. Thus, a semiconductor device wherein the two semiconductor chips are laminated and sealed with a resin, is reduced in manufacturing cost, and the thinning of the present semiconductor device is pushed forward.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.