Semiconductor device mount structure having heat dissipating member for dissipating heat generated from semiconductor device
US6337796B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2001 |
| Grant date | Jan 8, 2002 |
| Priority date | — |
| Expiry date | May 11, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device mount structure includes a heat dissipating member, a circuit board, a semiconductor device and a leaf spring member. The heat dissipating member has a mounting surface. The circuit board is opposed to the mounting surface of the heat dissipating member. The semiconductor device is mounted to the mounting surface of the heat dissipating member. The semiconductor device is electrically connected to the circuit board. The leaf spring member is arranged between the semiconductor device and the circuit board in such a manner that the leaf spring member biases the semiconductor device against the mounting surface of the heat dissipating member. The leaf spring member has a heat insulating material integrated on one side thereof which faces the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.