Method and system of manufacturing slurry for polishing, and method and system of manufacturing semiconductor devices
US6338670B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 17, 2000 |
| Grant date | Jan 15, 2002 |
| Priority date | — |
| Expiry date | Mar 17, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A manufacturing system of semiconductor devices, which comprises a dispersing equipment for dispersing inorganic oxide with water, a filtrating equipment provided behind the dispersing equipment for filtrating the slurry sent from the dispersing equipment, a supplying equipment provided behind the filtrating equipment for supplying the slurry sent from the filtrating equipment to a CMP polishing equipment, and the CMP polishing equipment provided behind the supplying equipment for polishing semiconductor devices by using the slurry supplied from the supplying equipment.According to the present invention, it is possible to supply slurry to the CMP polishing equipment at the right time in the right quantity. Accordingly, it is possible to eliminate the cost incurred by performing the strict quality control of the slurry during the storage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.