Conductive paste and ceramic printed circuit substrate using the same
US6338893B1 · kind B1 · utility
11Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1999 |
| Grant date | Jan 15, 2002 |
| Priority date | — |
| Expiry date | Oct 25, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ceramic printed circuit substrate includes a glass ceramic substrate and a surface circuit pattern, which is formed on the substrate by use of a conductive paste. The conductive paste contains conductive components of silver and platinum and filler components of molybdenum, tungsten, manganese dioxide, silicon dioxide and copper oxide. A ceramic green sheet and a surface circuit pattern formed thereon by use of the conductive paste are simultaneously fired at a temperature not higher than 1000° C., thereby yielding the ceramic printed circuit substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.