Leadframe for an encapsulated optocomponent

US6338983B1 · kind B1 · utility

Assignee

• Telefonaktiebolaget LM Ericsson (Publ) · SE

Inventors

• Odd Steijer · Bromma, SE
• Paul Eriksen · Djurås, SE

Key dates

• Filing date: May 18, 2000
• Grant date: Jan 15, 2002
• Expiry date: May 18, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002

Abstract

In encapsulating an optocomponent, a leadframe is used for the electrical connection of the component, the leadframe having a flag, to which the main body of the optocomponent is attached. The flag is located asymmetrically at an outer edge of the leadframe and is, in the encapsulating operation, placed close to a sidewall in a mold cavity in a mold. In this way, an optical interface of standard type can be obtained in the wall of the capsule. Further, the flag is flexibly attached, by zigzag-shaped bridges, to other portions of the leadframe so that the flag and thus the optocomponent will have a possibility to be resiliently and flexibly displaced a little at the positioning thereof in the mold cavity in the mold in relation to the other portions of the leadframe, in particular to its outer frame portions and bridge portions. By designing the zigzag-shaped bridges with a suitably adapted width and thickness a controlled elastic restoring force acting on the flag can be obtained and thus on the optocomponent so that it can be pressed and firmly retained in engagement with a positioning device for the optocomponent.