Patent · US Expired

Flow channel type heat dissipating fin set

US6340056B1 · kind B1 · utility

34Cited by
14References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 24, 2001
Grant dateJan 22, 2002
Priority date
Expiry dateApr 24, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A flow channel type heat dissipating fin set is formed by a plurality of metal pieces. Each metal piece comprises a body; and a connecting piece installed on the body having one or more connecting pieces punched from the body; the connecting piece being protruded from one side of the body; a via hole being formed on the body; and buckles and buckling holes being formed on the body. The metal pieces are combined by buckling the buckles and buckling holes so that the metal pieces are continuously buckled and stacked as a heat dissipating fin set; and via holes on the bodies of the metal pieces are formed as longitudinal flow channels. Thus, a flow channel type heat dissipating fin set is formed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.