Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus
US6340110B1 · kind B1 · utility
9Cited by
16References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2000 |
| Grant date | Jan 22, 2002 |
| Priority date | — |
| Expiry date | Feb 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1121
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A printed circuit board which has been soldered in a molten solder bath is cooled immediately thereafter with a cooling liquid at a rate of at least 10° C./second. Thermal effects of high-temperature solder during soldering are suppressed, and the metal matrix of the solder is refined, resulting in soldered connection of increased strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.