Electrical connection for wide-array inkjet printhead assembly with hybrid carrier for printhead dies
US6341845B1 · kind B1 · utility
182Cited by
20References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2000 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Aug 25, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/20
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A wide-array inkjet printhead assembly includes a carrier and a printhead die. The carrier includes a substrate and an electrical circuit. The substrate has a first side and a second side such that the electrical circuit is disposed on the second side of the substrate. The printhead die is mounted on the first side of the substrate and electrically coupled to the electrical circuit. Thus, electrical connection is established between the first side of the substrate and second side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.