Molding system using film heaters and/or sensors
US6341954B1 · kind B1 · utility
21Cited by
138References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2000 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Apr 14, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2067/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Improved mold manifold and hot runner nozzle using thin film elements include at least one active or passive thin film element disposed along a melt channel between the manifold inlet and the hot runner nozzle. Preferably, the thin film element may comprise a thin film heater in direct contact with the molten resin and position to aid in the heat and flow management of the resin within the melt channel. Thin film temperature sensors, pressure sensors, and leak detectors may also be provided in the vicinity of the melt channel to enhance process control in the injection molding machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.