Glass substrate chamfering method and apparatus
US6341999B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 26, 2000 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Sep 26, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/001
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for glass substrate chamfering using a metal-bonded outer-surface grindstone 12 for simultaneously processing the end surface and the oblique surfaces of the outer periphery of a doughnut-like glass substrate 1 with a circular hole 1a at the center thereof, and a metal-bonded inner-surface grindstone 14 for simultaneously processing the end surface and the oblique surfaces of the inner periphery are provided; the outer-surface grindstone and the inner-surface grindstone simultaneously grind end surfaces and oblique surfaces of the outer and inner peripheries of the glass substrate, and during grinding, the outer-surface grindstone is sharpened by dressing it electrolytically, and the inner-surface grindstone is sharpened by an electrolytic dressing when not processing as the glass substrate is being replaced. Thus, edge portions of the glass substrate for a hard disk can be processed accurately, efficiently, and with high quality, and the need for a subsequent process, such as buff-polishing, is reduced or even eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.