Flux-free brazing paste

US6342106B1 · kind B1 · utility

Assignee

• Degussa AG · DE

Inventors

• Jurgen Koch · Refrath, DE
• Sandra Wittpahl · Obertshausen, DE
• Leander Staab · Mömbris, DE

Key dates

• Filing date: Oct 25, 2000
• Grant date: Jan 29, 2002
• Expiry date: Oct 25, 2020

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K35/3613
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The invention relates t a flux-free brazing paste for the brazing of copper and copper alloys. The paste includes a binder consisting of a mixture of polyisobutene with a relative molar mass from 50,000 to 500,000 and paraffin within a melting-range from 40 to 90° C.