Diamond sintered compact and a process for the production of the same
US6342301B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1999 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Jul 28, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The present invention aims at providing a material for a diamond sintered compact tool, which has a high strength and is available as a material for a cutting tool.Accordingly, the present invention is concerned with a diamond sintered compact comprising a WC-Co type cemented carbide substrate having slight undulation and a diamond sintered compact bonded to one surface of the substrate by sintering during a step of sintering at an ultra-high pressure and high temperature, which has a plate thickness is 0.5 mm to 5 mm and an outer diameter is at least 20 mm and whose diamond sintered compact layer has at least 50% of a thickness area within a range of 0.05 mm to 0.4 mm and contains Co diffusing from the cemented carbide substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.