Epoxy resin composition for SF6 gas insulating device and SF6 gas insulating device
US6342547B1 · kind B1 · utility
3Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2000 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Feb 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/40
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided an epoxy resin composition, which has superior resistant property to SF6 gas, mechanical strength and cracking resistance in a well balanced manner and which can provide an insulating molded article having a low dielectric constant. The epoxy resin composition for an SF6-gas insulating device of the present invention is obtained by adding a silicate compound powder to an epoxy resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.