Photoelectric module device
US6342670B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2000 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Sep 19, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A photoelectric module device comprising a multiple layer printed circuit board and at least one photoelectric module device is provided. The multiple layer printed circuit board has at least an upper circuit board substrate, a lower circuit board substrate, and a circuit. A plurality of photoelectric elements are installed on the multiple layer printed circuit board and is electrically connected to the circuit. The photoelectric elements are packaged above the multiple layer printed circuit board by injection molding a transparent resin thereon. The lower substrate has a plurality of through holes formed therein and the inner wall of the through holes is plated with metal, as an electric terminal. The upper circuit board substrate serves to seal the through holes and prevent resin from permeating therein during the injection molding process. When the circuit board is cut into separate photoelectric module devices, after packaging, the inner wall of the through holes are partially cut away and the remaining portion thereof becomes a terminal for electrically connecting to external devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.