HSG lower electrode structure having a neck supported by a silicon layer
US6342714B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1999 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Feb 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/712
Abstract
A hemispherical grained (HSG) lower electrode, and its manufacturing method, are disclosed in which the yield is enhanced by suppressing the depletion due to insufficient diffusion of an impurity into the hemispherical grains (abbreviated also as HSGs) to reduce the deterioration in the capacity caused by the defect on the negative (lower) electrode side, and preventing the fracture of the HSGs. In a method of forming a capacitor composed of a polysilicon lower electrode, a dielectric film, and an upper electrode, the method of this invention includes at least a step of forming HSG silicon on the lower electrode, where each of its grains has a neck with decreased diameter on the side of the contact plane with the lower electrode, a step of depositing a silicon film covering the HSGs by filling the gaps between the lower electrode in the periphery of the necks and the HSGs while maintaining the rugged shape of the formed HSGs, a step of forming a dielectric film, and a step of forming an upper electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.